In modern electronic products, with the high integration of chips and the increasing power, chip heat dissipation is a problem that must be solved

Small heat sinks (also known as heat sinks) are made of aluminum alloy sheet material through stamping process and surface treatment, while large heat sinks are formed by extrusion of aluminum alloy into profiles, which are then machined and surface treated. They come in various shapes and sizes for installation of different devices and selection of devices with different power consumption. Radiators are generally standard components, and profiles can also be provided. Users can cut them into a certain length according to their requirements to make non-standard radiators. The surface treatment of the radiator includes electrophoretic painting or black oxygen polarization treatment, with the aim of improving heat dissipation efficiency and insulation performance. Under natural cooling, it can increase by 15%, under ventilated cooling, it can increase by 3%, and electrophoretic painting can withstand a voltage of 500 800V.

The heat dissipation work of the U CPU chip can be divided into two types according to the heat dissipation method: active heat dissipation and passive heat dissipation. Active heat dissipation is very simple, which means that the heat from the CPU chip is naturally dissipated into the air through the heat sink. The heat dissipation effect is proportional to the size of the heat sink. Its biggest advantage is that it does not require additional power consumption. This heat dissipation method is often used in military or professional equipment that does not have special requirements for space. Passive heat dissipation is mainly used for personal PCs, and passive heat dissipation is the process of forcibly taking away the heat emitted by the heat dissipation fins through cooling devices such as fans. Its characteristics are high heat dissipation efficiency and small device size.

Air-cooled radiator

The air-cooled heat sink is generally divided into two parts, and the part directly in contact with the CPU is the heat sink, which is responsible for extracting the heat emitted by the CPU; A fan is used to forcibly cool the heat sink. Through the organic combination of heat dissipation fins and fans, the efficiency of air-cooled radiators can be achieved very high, with a very small volume and relatively low cost.

The first issue encountered is the degree of tightness between the CPU and the heat sink, which is mainly related to the size of the bonding area and the bonding distance. The larger the combined area, the faster the heat can be dissipated, but due to

After the CPU is manufactured, its bonding area is determined, so the factor of bonding distance is even more important. Theoretically, the heat sink can be in close contact with the CPU, but actually there are gaps between them. At least there is air between them, and the thermal conductivity of air is very poor. This requires replacing air with something with better thermal conductivity and deformability to fill these gaps, which is now commonly used silicone grease or heat dissipation tape. Of course, it is also the ideal situation to tightly fasten the heat sink to the CPU through well-designed and powerful fasteners. The contact between the heat sink and the CPU is completely parallel to maintain the maximum contact surface, and the small gaps between them are completely filled with silicone grease to maintain the minimum contact heat.